solder bump meaning in Chinese
焊料隆起焊盘
焊锡球
焊锡凸块
锡突
撞击焊；焊接凸点
Examples
- Formation of electroplated solder bumps in wafer level packaging
焊料凸点制作工艺 - Lead - free solder bumping technology for wafer level package
圆片级封装的无铅焊料凸点制作技术研究 - Current research on the reaction between solder bump and under bump metallurgy systems in flip chip
倒装芯片中凸点与凸点下金属层反应的研究现状 - During subsequent reflow the solder pulls back onto the wettable pad surface to form a solid solder bump structure
在下一个回流工序，锡膏浸润焊盘表面，形成一个固态锡膏凸起。 - As an electric current passes through , the joule heating and electromigration effects occur in the flip chip solder bumps
当电流通过焊点时，会伴随产生焦耳热效应和电迁移效应。